Market Tape Free public data · delayed/cached
TM$182+2.67%GM$47.77+0.78%F$11.82+0.91%TSLA$175-0.18%BYDDY$61.85-1.69%RIVN$11.18-0.66%NIO$4.93+2.78%STLA$22.07-1.10%TM$182+2.67%GM$47.77+0.78%F$11.82+0.91%TSLA$175-0.18%BYDDY$61.85-1.69%RIVN$11.18-0.66%NIO$4.93+2.78%STLA$22.07-1.10%
Market & Tech Reports2025-05-13Clean view

Embedded World 2025: AI and SDV Solutions

Exhibitions of ETAS, Infineon, NXP, arm, and Tianma

AISDVSensorECUSoftwareSoCMCUHUDE E ArchitectureCPUInfineonNXP

Summary

The 20th "Embedded World 2025," organized by Nürnberg Messe GmbH, was held from March 11 to 13 at the exhibition venue in Nuremberg, Germany.

 More than 1,200 companies from approximately 46 countries exhibited a wide range of products, solutions, and the latest innovations — from components, modules, and complete systems to operating systems, hardware, software, and various services.

This year, technologies and proposals related especially to artificial intelligence (AI) and cybersecurity stood out and drew significant attention. The event attracted over 32,000 visitors from more than 80 countries, making it a great success. Alongside the exhibition, the "Embedded World Conference" and the "Electronic Displays Conference" were also held, featuring in-depth discussions and presentations.

The next Embedded World is scheduled to take place at the same Nuremberg venue from March 10 to 12, 2026.

Official Embedded World logo and venue (Organized by © NürnbergMesse GmbH)

Related Reports:
WCX 2025: AI, Chinese OEMs, and Future Powertrain (Apr. 2025)
Car IT Symposium 2025: Role of AI to achieving SDV (Apr. 2025)
Mobile World Congress 2025 (2) ITS, SDV solutions (Apr. 2025)
Elektrobit: SDV levels explained (Apr. 2025)
Mobile World Congress 2025 (1) AI and 5G (Mar. 2025)
CES - Artificial Intelligence (Mar. 2025)
CES 2025: Honda, BMW, Scout Motors concepts (Feb. 2025)
SDV: Software Update Concept and Mechanism (Jul. 2024)
Embedded World 2024: Innovations to facilitate SDV development (Jun. 2024)

Local Reconstruction Note

This article has been expanded from the visible local mirror text, headings, tags, image captions, tables, and related local article titles. It is presented as a reconstructed reading version, not as a hidden original document.

ETAS unveils Embedded AI Coder

The source outline identifies this section as part of “Embedded World 2025: AI and SDV Solutions”. Based on the available local metadata, this section should be read through the lens of AI, SDV, Sensor, ECU, Software, SoC and the visible introduction, figures, captions, and tables.

Infineon Technologies announces the first RISC-V microcontroller (MCU) family for automotive applications

The source outline identifies this section as part of “Embedded World 2025: AI and SDV Solutions”. Based on the available local metadata, this section should be read through the lens of AI, SDV, Sensor, ECU, Software, SoC and the visible introduction, figures, captions, and tables.

NXP Semiconductors announces the S32K5 microcontroller (MCU) family for automotive applications

The source outline identifies this section as part of “Embedded World 2025: AI and SDV Solutions”. Based on the available local metadata, this section should be read through the lens of AI, SDV, Sensor, ECU, Software, SoC and the visible introduction, figures, captions, and tables.

Arm expands its AI-optimized Libraries "Kleidi" into the automotive market

The source outline identifies this section as part of “Embedded World 2025: AI and SDV Solutions”. Based on the available local metadata, this section should be read through the lens of AI, SDV, Sensor, ECU, Software, SoC and the visible introduction, figures, captions, and tables.

Tianma Microelectronics unveils 8-inch MicroLED IRIS HUD

The source outline identifies this section as part of “Embedded World 2025: AI and SDV Solutions”. Based on the available local metadata, this section should be read through the lens of AI, SDV, Sensor, ECU, Software, SoC and the visible introduction, figures, captions, and tables.

Related Local Signals

Nearby records in the local archive include Taipei AMPA 2026: Foxconn’s EV Technology; Smart Energy Week 2026: Batteries and Charging; Electrified Vehicle (xEV) Sales Monthly Report (March 2026); Geely i-HEV Intelligent Hybrid Technology Presentation. These titles can be used as adjacent evidence when comparing suppliers, technologies, markets, and reporting periods.