Summary
The 20th “embedded world” 2024, organized by NürnbergMesse GmbH, was held from April 9 to 11 at the exhibition center in Nuremberg, Germany. More than 1,100 companies from nearly 50 countries presented a full range of products, solutions, and innovations, from components, modules, and complete systems to operating systems, hardware, software, and services, and the event attracted well over 32,000 visitors from over 80 countries, 20% more than last year. Next year's embedded world 2025 again will be held at the Nuremberg Exhibition Centre from March 11 to 13, 2025.
Embedded worldwide
Embedded world China will be held in Shanghai from June 12 to 14, 2024, and embedded world North America will be held October from 8 to 10, 2024, in Austin, Texas.
This report covers the keynote speeches and the latest announcements that are driving the development and integration of SDV in-vehicle architectures.
| Official Embedded World logo and venue (Organized by © NürnbergMesse GmbH) | |
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Local Reconstruction Note
This article has been expanded from the visible local mirror text, headings, tags, image captions, tables, and related local article titles. It is presented as a reconstructed reading version, not as a hidden original document.
Keynote speech “AI on the Edge: Unlocking the Potential of AI Applications” (AMD)
The source outline identifies this section as part of “Embedded World 2024: Innovations to facilitate SDV development”. Based on the available local metadata, this section should be read through the lens of SDV, Software, AI, AMD, ECU, SoC and the visible introduction, figures, captions, and tables.
Integration of hardware and software for SDV, automotive E/E architecture (NXP Semiconductors)
The source outline identifies this section as part of “Embedded World 2024: Innovations to facilitate SDV development”. Based on the available local metadata, this section should be read through the lens of SDV, Software, AI, AMD, ECU, SoC and the visible introduction, figures, captions, and tables.
Quad-port for Software Defined Vehicle (Micron Technology)
The source outline identifies this section as part of “Embedded World 2024: Innovations to facilitate SDV development”. Based on the available local metadata, this section should be read through the lens of SDV, Software, AI, AMD, ECU, SoC and the visible introduction, figures, captions, and tables.
Related Local Signals
Nearby records in the local archive include Taipei AMPA 2026: Foxconn’s EV Technology; Smart Energy Week 2026: Batteries and Charging; Electrified Vehicle (xEV) Sales Monthly Report (March 2026); Geely i-HEV Intelligent Hybrid Technology Presentation. These titles can be used as adjacent evidence when comparing suppliers, technologies, markets, and reporting periods.