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Market & Tech Reports2026-04-28Clean view

Taipei AMPA 2026: Foxconn’s EV Technology

BEVs, batteries, information and communications technology, automotive semiconductors

Summary

The comprehensive automobile, motorcycle, and car electronics expo “360° Mobility Mega Shows 2026”, organized by TAITRA (Taiwan External Trade Development Council) was held at the Taipei Nangang Exhibition Center from April 14th to 17th, 2026. The event consisted of three exhibitions, including the Taipei AMPA 2026 (Taipei International Automobile & Motorcycle Parts & Accessories Show), which is one of Taiwan's largest automobile and motorcycle trade shows.

The theme of this year's expo was "Empower Every Move," and it attracted visitors from 90 countries, with approximately 2,500 buyers and industry professionals in attendance. At the exhibition booths, solutions for automotive electronics, powertrain systems, and smart manufacturing were on display, reflecting the trends toward intelligent systems, electrification, and the transition to low-carbon technologies.

This report introduces the exhibits presented by the Foxconn Group (Hon Hai Group), which had the largest booth at this trade show.

Entrance Foxconn Group's booth

Local Reconstruction Note

This article has been expanded from the visible local mirror text, headings, tags, image captions, tables, and related local article titles. It is presented as a reconstructed reading version, not as a hidden original document.

BEVs

The source outline identifies this section as part of “Taipei AMPA 2026: Foxconn’s EV Technology”. Based on the available local metadata, this section should be read through the lens of Hon Hai, BEV, EV battery, HMI, Battery Pack, Antenna and the visible introduction, figures, captions, and tables.

High-Performance Computing Platform, TCU

The source outline identifies this section as part of “Taipei AMPA 2026: Foxconn’s EV Technology”. Based on the available local metadata, this section should be read through the lens of Hon Hai, BEV, EV battery, HMI, Battery Pack, Antenna and the visible introduction, figures, captions, and tables.

Automotive semiconductors

The source outline identifies this section as part of “Taipei AMPA 2026: Foxconn’s EV Technology”. Based on the available local metadata, this section should be read through the lens of Hon Hai, BEV, EV battery, HMI, Battery Pack, Antenna and the visible introduction, figures, captions, and tables.

Related Local Signals

Nearby records in the local archive include Smart Energy Week 2026: Batteries and Charging; Electrified Vehicle (xEV) Sales Monthly Report (March 2026); Geely i-HEV Intelligent Hybrid Technology Presentation; Mobile World Congress 2026 (3) Evolution of Connected and Autonomous Mobility. These titles can be used as adjacent evidence when comparing suppliers, technologies, markets, and reporting periods.