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TM$179+0.45%GM$47.86+2.51%F$11.95-2.16%TSLA$179-1.95%BYDDY$61.28+1.42%RIVN$11.14+0.41%NIO$5.00-0.28%STLA$21.60+0.22%TM$179+0.45%GM$47.86+2.51%F$11.95-2.16%TSLA$179-1.95%BYDDY$61.28+1.42%RIVN$11.14+0.41%NIO$5.00-0.28%STLA$21.60+0.22%
News2026-04-20Clean view

Government of India breaks ground on first advanced 3D chip packaging plant in Odisha

On April 19, the Ministry of Electronics and IT announced that the foundation stone for India's first advanced 3D chip packaging facility was laid at Info Valley, Bhubaneswar. The project is being implemented by 3D Glass Solutions Inc. (USA) through its wholly owned Indian subsidiary Heterogeneous Integration Packagi....

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Related local items around this topic include Thailand deepens U.S. semiconductor investment talks, including automotive applications; Bosch unveils third generation of SiC semiconductors; Rohm develops fifth-generation SiC power semiconductor with reduced on-resistance at high temperatures; FAW unveils China’s first automotive-grade five-domain integrated SoC Hongqi One. These references help place the update in a broader sequence of market, supplier, technology, and policy developments.

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